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T6 EVO Series provides the advantages of both 3D laser inspection & 2D vision inspection. It is absolutely the best choice for customers. |
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 FETURES |
T8 system is good for various packing type IC.
- TSOP (Type I & II)
- CSP (FBGA & uBGA)
- BGA
- QFP
- QFN
- Others package in JEDEC tray.
- Non-JEDEC tray upon request.
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| SPECIFICATION |
Item |
Specification & Description |
IC Packing Specification |
1. TSOP (Type I & II)
2. CSP (FBGA & uBGA)
3. BGA (19x19mm, 27x27mm)
4. QFP
5. QFN
6. Others package in JEDEC tray.
7. Non-JEDEC tray upon request.
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Operation Mode |
1. Operation mode
2. Taping with selectable vision inspection criteria.
3. Tray to tray lead scanning with automatic reject and empty pocket replenish.
4. Tape to tray for re-work purpose
5. Taping with combine lot capability
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System Specification |
1. Pick and place accuracy < 0.1mm 2. MUBA 3000 or better. 3. MTBA >1 hour. 4. MTBF >1000 hour 5. MTTR < 30 minutes 6. Mechanical calibration can be achieved using jigs. 7. Approximated machine size: 1900 X 1400 X 2000 (W X D X H) |
| DOWNLOAD |
Item |
Specification
& Description |
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