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Chapman：MPT-1000 Non-Contact Thickness Measuring System |
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MPT1000 is Chapman Instruments’ latest noncontact system, providing wafer thickness measurements.Specially designed for final backgrind wafers, it can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. |
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- Non-contact, providing non-destructive measurements to finished wafers
- 0.1 µm thickness resolution, providing thickness uniformity and Q/C control
- 1 µm laser spot size on both top and bottom wafer surfaces, providing the ability to distinguish between small features, e.g. bumped wafers
- Optical Measurement System, providing accurate wafer thickness measurements independent of material properties, especially useful for patterned wafers, GaAs and other wafer types
- Nomarski Viewing System, provides high definition examination of small features on the wafer surface
- Measurement at any location, provides thickness uniformity information
- Measurement through tape on a patterned wafer, provides direct feedback for production wafers, no need to use a separate test wafer. Provides cost reduction by eliminating a test wafer procedure.
- Measurement on backgrind wafers, or after dicing, provides flexibility for measurements at different steps
- Automated Focusing, provides automatic measurements for a variety of wafer types and thicknesses without other special setup
- Customized measurement sequences with multiple scans implemented with a single keystroke
- Optional robotic handling |
| SPECIFICATION |
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